Industrialization and testing
At Psicontrol, industrialization and testing are key areas that enable us to deliver repeatable, scalable, and high‑quality electronics manufacturing. As part of the development process, we create a dedicated industrialization team for you to ensure your product can be produced efficiently and with a consistent level of quality.
Smart, data‑driven manufacturing optimization
By applying Design for Excellence (DfX) principles, we are able to optimize producibility, assembly, testing, and long‑term reliability. Our approach combines DfX with lean manufacturing, Six Sigma methodologies, and real‑time data logging & analysis. This ensures every step of the production process will be stable, efficient, and fully optimized.
Seamless industrialization for existing customer designs
For existing customer designs, we operate in full EMS mode. This involves developing custom production test systems, creating assembly tools, setting up logistics and packaging, and defining the quality assurance framework. Once the industrialization phase is complete, we can then prepare your product for smooth and scalable mass production across our manufacturing sites.
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Build testability into the product
We embed testing from day one to accelerate time‑to‑quality. This Design for Test (DfT) approach reduces risk, shortens ramp‑up, and increases first‑pass yield in series production.
- Testability investigation (analysis phase)
Early review and recommendations to improve access, coverage, and test efficiency.
- Detailed test strategy (proto phase)
Definition of structural & functional test flows, fixtures, interfaces, and equipment.
- DPMO calculation for optimal yield
Data‑driven balancing of test depth vs. throughput and cost for optimal yield.
Smart test strategy: optimal coverage at the right cost
At Psicontrol, we develop a tailored test strategy for every product. This involves selecting the optimal combination of test methods and flows to balance development and production test costs with the required quality levels.
Our complete portfolio of test and inspection technologies:
- X‑ray inspection – BGA, QFN, hidden joints
- Structural testing – ICT, boundary scan/JTAG, Flying Probe
- Functional testing – End‑of‑line and custom fixtures, with our own dedicated “PsiMate” test system
- In‑Circuit Testing (ICT) for component‑level validation
- Flying Probe testing for prototypes and low‑volume/high‑mix
- Programming – MCU/FPGA/memory, calibration
- Battery testing & charging
- Camera/vision testing for optical validation
- Burn-in tests
Combined with inline SPI/AOI on our SMT lines, this results in reliable products, predictable quality, and efficient production – from prototypes to high‑volume builds.
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